Mfr Package Description | WINDOWED, CERAMIC, DIP-28 |
Status | Transferred |
Sub Category | EPROMs |
Access Time-Max | 200 ns |
I/O Type | COMMON |
JESD-30 Code | R-GDIP-T28 |
JESD-609 Code | e0 |
Memory Density | 262144 bit |
Memory IC Type | UVPROM |
Memory Width | 8 |
Number of Functions | 1 |
Number of Terminals | 28 |
Number of Words | 32768 words |
Number of Words Code | 32K |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Min | 0.0 Cel |
Operating Temperature-Max | 70 Cel |
Organization | 32KX8 |
Output Characteristics | 3-STATE |
Package Body Material | CERAMIC, GLASS-SEALED |
Package Code | WDIP |
Package Equivalence Code | DIP28,.6 |
Package Shape | RECTANGULAR |
Package Style | IN-LINE, WINDOW |
Parallel/Serial | PARALLEL |
Power Supplies (V) | 5 |
Programming Voltage (V) | 12.75 |
Qualification Status | Not Qualified |
Seated Height-Max | 5.72 mm |
Standby Current-Max | 1.00E-4 Amp |
Supply Current-Max | 0.0400 Amp |
Supply Voltage-Nom (Vsup) | 5 V |
Supply Voltage-Min (Vsup) | 4.5 V |
Supply Voltage-Max (Vsup) | 5.5 V |
Surface Mount | NO |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Finish | Tin/Lead (Sn/Pb) |
Terminal Form | THROUGH-HOLE |
Terminal Pitch | 2.54 mm |
Terminal Position | DUAL |
Width | 15.24 mm |
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